Microstructural and mechanical analysis on Cu–Sn intermetallic micro-joints under isothermal condition

Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging

Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the criti­ cal limit for Au content in Pb-free solder joints is not well established. Three surface-mount ...

response articles: micro and macro analysis

the present study reports an analysis of response articles in four different disciplines in the social sciences, i.e., linguistics, english for specific purposes (esp), accounting, and psychology. the study has three phases: micro analysis, macro analysis, and e-mail interview. the results of the micro analysis indicate that a three-level linguistic pattern is used by the writers in order to cr...

The Effect of Welding Energy on the Microstructural and Mechanical Properties of Ultrasonic-Welded Copper Joints

The effects of welding energy on the mechanical and microstructural characteristics of ultrasonic-welded pure copper plates were investigated. Complex dynamic recrystallization and grain growth occurred inside the weld zone during ultrasonic welding. At a low welding energy, a thin band of straight weld interfaces was observed and had an ultra-fine grain structure. With an increase in welding e...

Effect of Different Welding Parameters on the Mechanical and Microstructural Properties of Stainless Steel 304H Welded Joints

In this research work, an attempt has been made to examine the different welding parameters which affect the weldability of 304H Austenitic stainless steel (ASS) welded joint using the proper filler wire. Chemical composition of filler wire was same as that of base metal. Further this study addressed the combined effect of various welding parameters on the metallurgical and mechanical propertie...

Effect of Au Content on Microstructural Evolution of SnAgCu Solder Joints that Undergo Isothermal Aging and Reliability Testing